What’s new at PACK EXPO

July 9, 2012, Chicago – PACK EXPO International 2012 will be
this year’s most comprehensive processing and packaging event in North America,
says show organizers.  

Running Oct. 28 to 31 at McCormick Place in Chicago, the
show will feature more than 1,800 exhibitors highlighting innovation across the
line, including equipment, materials and components.  

To help baking and snack brand owners easily locate the solutions
and suppliers they need, PACK EXPO International includes industry specific pavilions
and features. The Baking-Snack Break lounge, sponsored by the Snack Food
Association (SFA) will provide baking and snack manufacturers with a designated
area to trouble-shoot their unique challenges with industry piers and
suppliers.

The Brand Zone will help brands break out of the packaging
box, with innovative containers and materials for a competitive edge at the
point-of-sale and stronger consumer loyalty. Within The Brand Zone, attendees can
explore award-winning package designs at The Showcase of Packaging Innovations,
sponsored by The Dow Chemical Company, learn about exciting new materials from
Material ConneXion and understand the latest consumer drivers from the
intelligence experts at Mintel.

 The Processing Zone will spotlight the latest processing technology.

 Here is a sneak peak of the innovations you can expect to
see at the show:

Enhance visual appeal
with flexible box pouch packaging: Brands can create a unique shelf
presence with Ampac’s (booth #2183) new box pouch capabilities. The format’s
five-panel display with registered print provides a powerful billboard for
brand messaging and improved package presentation with a truly flat bottom.
Easy to open and resealable features such as Ampac’s E-Z Zip technology,
QuickZip to press to close zippers can be added to enhance convenience. Four
box pouch styles are available: flat bottom full gusset, flat bottom terminated
gusset, pinch bottom, and flat top and bottom. Pouch efficiencies include
better cube utilization during shipping and faster filling rates than bottom
gusset pouches. (Box pouches are wider front-to-back). Food applications for
the box pouch include dried foods, nuts, cereal, confections, baking powders
and frozen foods. Lawn and garden, powders and beverages are also potential
applications.

Prolonging the life
of power transmission devices: Misalignment between drive and load devices
can lead to bearing, shaft or seal failure. Candy Manufacturing Co. Inc.’s (booth
6140) Coup-Link technology, a full line of zero backlash flexible shaft
couplings, are capable of handling many types of misalignment and may offset
problems such as minor design errors or improper assembly. The new line
includes Beam, Bellows, Jaw, Disc and Oldham type couplings in a variety of
mounting options, including set screw, keyway, clamp, conical and shrink disc
configurations.

New label printing technology for enhanced security: SATO (booth
# 6203) will showcase its newly enhanced series of industrial tabletop printers.
The SATO CL4e HF RFID Series thermal transfer and direct thermal printers
enable operators to use HF RFID tags for product authentication and asset
tracking. The technology produces faster transactions with the benefit of
secure wireless data collection.

To register for PACK EXPO International 2012, visit www.packexpo.com.