Messe Dusseldorf to promote packaging fairs
By Bakers Journal
By Bakers Journal
Aug. 5, 2015, Las Vegas – Messe Düsseldorf will participate in Pack Expo Las Vegas 2015 to promote its upcoming international trade fair for the packaging industry.
Interpack Processes and Packaging 2017 will be held May 4-10, 2017, in Düsseldorf, Germany. The trade fair is organized by Messe Dusseldorf North America.
During Pack Expo, which runs Sept. 28-30, interpack will be at booth S-6832 to offer up visitor information about its 2017 event and distribute exhibitor applications for individual booth space and the show’s U.S. Pavillon. Information about hotel and travel arrangements will also be available.
Every three years, interpack attracts more than 2,700 exhibitors from more than 58 countries. Exhibitors present a comprehensive international range of products, including the latest in packaging systems and machinery, packaging materials and confectionery machinery in 19 halls covering over 2 million square feet net of exhibit space.
More than 175,000 visitors from around the world participated in the event during its last staging in 2014.
Messe Düsseldorf will also be promoting other packaging trade fairs in its worldwide program, including SWOP 2015 (Nov. 17-20 in Shanghai, China), Upakovka 2016 (Jan. 26-29, 2016 in Moscow, Russia), IndoPack 2016 (Sept. 7-10, 2016 in Jakarta, Indonesia) and International PackTech India 2016 (Dec. 15-17, 2016 in Mumbai, India).
For information on visiting or exhibiting at interpack 2017 or any of the other packaging trade fair in the Messe Düsseldorf program, visit booth S-6832 at Pack Expo 2015 or contact Messe Düsseldorf North America by phone at (312) 781-5180 or by email at email@example.com.
Additional information is also available at www.mdna.com.