Bakers Journal

Key hardware ingredients for baking success at PACK EXPO

August 25, 2009

packexpo1Aug. 25, 2009 – A challenging economy is the best
time for packaging innovation. With signs pointing to recovery in 2010, brands
can position themselves for success by investing in innovation now. 

At PACK EXPO (Oct. 5-7, Las Vegas
Convention Center), baked goods manufacturers will discover the innovation they
need to build stronger brands, enhance production efficiencies, meet sustainability
requirements and reduce total systems costs. In a single trip, attendees can
examine the latest packaging technologies from more than 1,000 exhibitors,
making the show a cost-effective, convenient solution to find the innovation
they need.

With so many resources under one
roof, discovering innovation is easy. Here’s a preview of some of the many
technologies baked goods manufacturers can’t afford to miss at PACK EXPO.


Minimize labour, increase

ARPAC’s intermittent motion DPM 2000 Series wrap-around case/tray packer helps
minimize labour requirements and increase production output. In addition, the
use of wrap-around case or tray blanks can reduce the amount of corrugated
board used by up to 25 per cent, with additional savings in warehouse space and
lower handling costs.

The DPM-2000 integrates blank
feeding, product loading, case forming and container sealing into a single
compact machine, making the system ideal for packaging cans, jars, bottles and
a variety of other package formats. The series reaches speeds up to 25
cases/trays per minute.

optimizes production and performance

International Group’s newly re-designed PouchPack system plucks, opens, fills
and seals one to four pouches from a magazine with a single robotic arm,
optimizing production and operator performance. The PouchPack has the capacity
for a range of configurations and runs lay-flat and/or stand-up zip pouches,
which can receive either a label or inkjet code. Filling can be done manually or
with the help of a robot or scale.

New VFFS cost-effective,

packexpo2The new
Phaser XP VFFS system from Parsons-Eagle Packaging Systems combines operational
simplicity with superior performance and reliability at a minimal investment.
Capable of producing pillow, gusseted or flat bottom packages from two inches
to 13 inches in width and three inches to 15 inches in length, the Phaser XP
operates at speeds in excess of 60 packages per minute.

include color touch screen control, quick-thread film path, and an open
architecture construction for easy changeover and maintenance. Several machine
options are available, including a package support with ultra-low profile frame
design, fibre-optic print registration, polyethylene film seal jaws, hole
punch, tear notch and flavor injection.

Easy clean, quick

Improved cleanability and
serviceability are the hallmarks of the new XPdius Elite VFFS system from
WeighPack Systems, Inc. (Booth # C-3023). 
The open, accessible design allows easy access to all operating
functions and all mechanics can be accessed from four sides of the system with
no obstruction.

The XPdius Elite also offers
quicker film changeover thanks to features such as an easy-to-unwind film
roller assembly, film tracking that leaves film centered at all times, and a
film splicing table.

The system can run different
plastics and produces a variety of bag types, including gusset, pillow bags and
daisy chain pouches. The system operates at up to 120 bags per minute.

Versatile case packer
minimizes maintenance

Robotic product handling,
flexibility and versatility serve as the foundation for the CP15 24RI Robotic
Case Packing System from Z Automation Company. The system serves two main
functions: combining expert product collation with the ability to achieve a
wide variety of stacking configurations, and the functionality of a product
buffer in the event downstream equipment is inoperative.

The servo-driven system is
user-friendly and offers quick, tool-less changeover in ten minutes or less
with minimal tweaking and maintenance.

To register for PACK EXPO, or for
more information, visit

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