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Key hardware ingredients for baking success at PACK EXPO
packexpo1Aug. 25, 2009 – A challenging economy is the best time for packaging innovation. With signs pointing to recovery in 2010, brands can position themselves for success by investing in innovation now. 

At PACK EXPO (Oct. 5-7, Las Vegas Convention Center), baked goods manufacturers will discover the innovation they need to build stronger brands, enhance production efficiencies, meet sustainability requirements and reduce total systems costs. In a single trip, attendees can examine the latest packaging technologies from more than 1,000 exhibitors, making the show a cost-effective, convenient solution to find the innovation they need.

With so many resources under one roof, discovering innovation is easy. Here’s a preview of some of the many technologies baked goods manufacturers can’t afford to miss at PACK EXPO.

Minimize labour, increase production

ARPAC’s intermittent motion DPM 2000 Series wrap-around case/tray packer helps minimize labour requirements and increase production output. In addition, the use of wrap-around case or tray blanks can reduce the amount of corrugated board used by up to 25 per cent, with additional savings in warehouse space and lower handling costs.

The DPM-2000 integrates blank feeding, product loading, case forming and container sealing into a single compact machine, making the system ideal for packaging cans, jars, bottles and a variety of other package formats. The series reaches speeds up to 25 cases/trays per minute.

PouchPack optimizes production and performance

OK International Group’s newly re-designed PouchPack system plucks, opens, fills and seals one to four pouches from a magazine with a single robotic arm, optimizing production and operator performance. The PouchPack has the capacity for a range of configurations and runs lay-flat and/or stand-up zip pouches, which can receive either a label or inkjet code. Filling can be done manually or with the help of a robot or scale.

New VFFS cost-effective, reliable

packexpo2The new Phaser XP VFFS system from Parsons-Eagle Packaging Systems combines operational simplicity with superior performance and reliability at a minimal investment. Capable of producing pillow, gusseted or flat bottom packages from two inches to 13 inches in width and three inches to 15 inches in length, the Phaser XP operates at speeds in excess of 60 packages per minute.

Features include color touch screen control, quick-thread film path, and an open architecture construction for easy changeover and maintenance. Several machine options are available, including a package support with ultra-low profile frame design, fibre-optic print registration, polyethylene film seal jaws, hole punch, tear notch and flavor injection.

Easy clean, quick changeover

Improved cleanability and serviceability are the hallmarks of the new XPdius Elite VFFS system from WeighPack Systems, Inc. (Booth # C-3023).  The open, accessible design allows easy access to all operating functions and all mechanics can be accessed from four sides of the system with no obstruction.

The XPdius Elite also offers quicker film changeover thanks to features such as an easy-to-unwind film roller assembly, film tracking that leaves film centered at all times, and a film splicing table.

The system can run different plastics and produces a variety of bag types, including gusset, pillow bags and daisy chain pouches. The system operates at up to 120 bags per minute.

Versatile case packer minimizes maintenance

Robotic product handling, flexibility and versatility serve as the foundation for the CP15 24RI Robotic Case Packing System from Z Automation Company. The system serves two main functions: combining expert product collation with the ability to achieve a wide variety of stacking configurations, and the functionality of a product buffer in the event downstream equipment is inoperative.

The servo-driven system is user-friendly and offers quick, tool-less changeover in ten minutes or less with minimal tweaking and maintenance.

To register for PACK EXPO, or for more information, visit www.packexpo.com.